Sputtering System 

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment by high-energy particles. Today, it’s a more mature process, usage is widespread and the technology used is quickly advancing.  

The vacuum system of a sputter coater is more Like all coaters, a base pressure in the high-vacuum range is required 

All types of machines

• Cylindrical or parallelepipedal chambers, with front door or top lid

• Standard chambers : 350, 400, 450, 600, 900 mm in diameter

• Single wafer or cassette load-lock

• Rectangular or circular DC and RF cathodes

• Sputter up/down configurations

• Clusters for confocal systems, true co-sputtering

• Reactive and non-reactive sputtering

• Static or dynamic deposition, planetary and double planetary rotation, oscillation

• RF bias on substrates prior to and during deposition

• Substrate temperature up to 1000°C